Method and apparatus for evaluating integrated circuit packages having three dimensional features
US7034272B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2000 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides for methods and an apparatus for evaluating objects having three dimensional features. One method involves using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can be used to pre-qualify the three dimensional data set, or may be used to locate that data within the three dimensional data set that is characteristic of the three dimensional feature. The invention may include a sensor configured to capture both three dimensional and two dimensional data. The present invention provides for an efficient technique to evaluate three dimensional data. The present invention also solves heretofore unrecognized problems associated with geometric distortion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.