High-power, integrated AC switch module with distributed array of hybrid devices
US7034345B2 · kind B2 · utility
15Cited by
9References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel architecture of high-power four-quadrant hybrid power modules based on high-current trench gate IGBTs and arrays of low-current wide-bandgap diodes is conceived. The distributed physical layout of high power density wide-bandgap devices improves the cooling inside a fully-sealed module case, thus avoiding excessive internal heat flux build up and high PN junction temperature, and benefiting the converter's reliability and efficiency. The design of multiple-in-one hybrid integrated AC-switch module at high power ratings is enabled by using hybrid AC switch cells and aluminum nitride substrate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.