Power semiconductor module with cooling element and pressing apparatus
US7034395B2 · kind B2 · utility
16Cited by
4References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 9, 2004 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Apr 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor power module (1) comprises at least a substrate (2) including at least a semiconductor element (6, 7, 8) and a pressing device (40) which acts on the substrate (2). The pressing device (40) enables to press the substrate (2), when mounted, on a cooling element (30) so as to evacuate from semiconductor components operational heat losses. The pressing device (40) consists of a housing (10) provided with at least an elastic deformation zone (16, 17, 15, 18, 19).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.