Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby
US7034544B2 · kind B2 · utility
5Cited by
13References
20Claims
0Family size
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Key dates
| Filing date | Jun 30, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Jun 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus that minimize the impedance discontinuity between a component and a signal trace is described. The methods and apparatus generally comprise at least one signal trace disposed on a dielectric layer, wherein the signal trace comprises a first width which is wider than a second width, a via connected to the first width of the signal trace, and a component electrically attached to the via, wherein an impedance discontinuity between the signal trace and the component is lowered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.