Semiconductor device
US7035081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Oct 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention eliminates a need to increase a size of a semiconductor device and reduces occurrence of noise. A semiconductor device of the invention includes: a base (5) having front layers (9, 11) provided on respective sides of a core layer (7) formed by a printed circuit board, and a semiconductor chip (1) mounted on the base (5), wherein the semiconductor chip (1) is joined to one (9) of the front layers by using a joining member (3), and the other front layer (11) has a plurality of external terminals (55) arranged thereon, and the core layer (7) has a plurality of through-holes (41, 43, 45, 75, 77) formed therein to electrically connect the semiconductor chip (1) to the plurality of external terminals (55) together, and the plurality of through-holes (41, 43, 45, 75, 77) include a plurality of arrayed through-holes (41, 43, 45) arranged correspondingly to the arrangement of the plurality of external terminals (55) and one or more additional through-holes (75, 77) formed between the plurality of arrayed through-holes (41, 43, 45).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.