Manufacturing method of rigid-flexible printed circuit board and structure thereof
US7036214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Aug 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.