Method for manufacturing a high-efficiency thermal conductive base board
US7036219B2 · kind B2 · utility
4Cited by
10References
10Claims
0Family size
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Inventor
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Jun 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a high-efficiency thermal conductive base board for electrical connection with an electronic component includes the steps of: (a) placing a metal substrate in an electrolytic bath; (b) oxidizing the metal substrate in the electrolytic bath to form a metal oxide layer thereon through micro-arc oxidation; (c) forming a plurality of conductive contacts on the metal oxide layer for electrical connection with the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.