Pin-deposition of conductive inks for microelectrodes and contact via filling
US7036220B2 · kind B2 · utility
2Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Jul 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.