Thermal flow sensor having recesses in a substrate
US7036369B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Jun 30, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/6845
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.