Modular surface mount manifold assemblies
US7036528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87885
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A modular manifold system is provided for interconnecting fluid components of a fluid system in a reduced area. The system is comprised of a one or more bridge fittings having an internal fluid passageway which has an inlet end in fluid communication with an outlet port of a first fluid component, and an outlet end in fluid communication with an inlet port of a second fluid component. The bridge fittings may additionally comprise two or more ports, which one of said ports may be in fluid communication with a manifold on another substrate level. The bridge fittings may be mounted within a channel of a backing plate for structural support or in channel blocks of varying sizes. The bridge fittings may also be mounted to the locator plate in multiple directions forming multiple flow paths. The bridge fittings may be stacked to form multiple layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.