Method of molding low melting point metal alloy
US7036551B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2005 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S164/90
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a method of molding a low-melting-point metal alloy which exhibits thixotropy properties in a solid-phase and liquid-phase coexisting temperature region. In this method, a temperature of a heating holding cylinder is increased to a liquidus temperature or higher at the start of a molding operation. Then a remaining material in the preceding molding remaining in the heating holding cylinder in a solid state is wholly melted. After that a temperature of the heating holding cylinder is lowered to a temperature in the solid-phase and a liquid-phase coexisting temperature region. At the same time a molding material is supplied and a provisional molding is carried out. After the temperature has reached the solid-phase and liquid-phase coexisting temperature region, a regular molding is started. By the present invention a problem of a remaining material in the heating holding cylinder, which becomes a trouble at the start of molding by injection, is solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.