Attaching integrated circuits to printed circuit boards
US7037115B2 · kind B2 · utility
1Cited by
11References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 13, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | May 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A land grid array socket may receive an integrated circuit package for electrical connection thereto through lands on the integrated circuit package and spring contacts which extend upwardly to engage those lands from the socket. A protector plate may be situated over the spring contacts prior to the time at which the integrated circuit package is assembled onto the socket. As a result, the spring contacts on the socket may be prevented from damage prior to the time that they are engaged by the integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.