Advanced wafer planarizing
US7037172B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | May 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/80
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for planarizing is disclosed. A method of planarizing is disclosed. Methods of planarizing using frictional planarizing, chemical planarizing, tribochemical planarizing, CVD planarizing, and electrochemical planarizing and combinations thereof are disclosed. A planarizing chamber can be used. New methods of control are planarizing disclosed. The new planarizing methods and apparatus, can help improve yield and lower the cost of manufacture for planarizing of workpieces having extremely close tolerances such as semiconductor wafers. Cost of manufacture parameters are used for control. Methods to determine preferred changes to process control parameters are disclosed. Cost of manufacture models can be used and are disclosed. Process models can be used and are disclosed. A method to use business calculations combined with physical measurements to improve control is discussed. Use of business calculations to change the cost of finishing semiconductor wafers is discussed. The method can help cost of manufacture forecasting for pre-ramp-up, ramp-up, and commercial manufacture. Activity based accounting can be preferred for some applications. Planarizing fluids are preferred.…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.