Copper foil for printed-wiring board
US7037597B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | May 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to provide a surface-treated copper foil wherein a surface layer which is situated on a side being not bonded to a resin in a copper foil for a printed-wiring board and on which a copper direct drilling process by carbon dioxide laser is easily applied is prepared with a small amount of a covering material in accordance with a simple manner.In the copper foil used for a direct drilling process by laser of the present invention, 50 to 1000 mg/m2 of a covering layer consisting of iron and tin, or a covering layer made of an alloy prepared from iron, tin, and at least one member selected from the group consisting of nickel, cobalt, zinc, chromium, and phosphorous is provided on at least one side of the copper foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.