Patent · US Expired

Method of manufacturing a semiconductor light-emitting element

US7037738B2 · kind B2 · utility

94Cited by
4References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 17, 2003
Grant dateMay 2, 2006
Priority date
Expiry dateDec 8, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/82

Abstract

There is disclosed a semiconductor light-emitting element comprising a substrate having a first surface and a second surface, a semiconductor laminate formed on the first surface of the substrate and containing a light-emitting layer and a current diffusion layer having a light-extracting surface. The light-emitting element is provided with a light-extracting surface which is constituted by a finely recessed/projected surface, 90% of which is constructed such that the height of the projected portion thereof having a cone-like configuration is 100 nm or more, and the width of the base of the projected portion is within the range of 10-500 nm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.