Manufacturing method of circuit substrate, circuit substrate and manufacturing device of circuit substrate
US7037812B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Dec 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 μm to 100 μm and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.