Patent · US Expired

Method of producing a module

US7038128B2 · kind B2 · utility

1Cited by

17References

16Claims

0Family size

Assignee

GIESECKE & DEVRIENT GMBH · DE

Inventors

Renee-Lucia Barak · Unterhaching, DE
Josef Riedel · Altötting, DE
Rene-Lucia Barak · Unterhaching, DE

Key dates

Filing date	Feb 28, 2002
Grant date	May 2, 2006
Priority date	—
Expiry date	Oct 11, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53178
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method is described for producing a module to be incorporated in a card body wherein a module carrier is provided with a conductive structure on one side. During production of the module carrier, a material whose properties essential for a certain manner of connection with a layer of material of the card body upon incorporation of the module in the card body are adjusted to said layer of material is used at least for a first layer of the module carrier located on the side opposite the conductive structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.