Power module with improved heat dissipation
US7038310B1 · kind B1 · utility
14Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2000 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Oct 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a power module that is excellent in heat dissipation and suitable for the trend of miniaturization with high density, and provides also a method of manufacturing the same. The power module includes an insulating layer including an inorganic filler and a thermosetting resin composition, a lead formed on the surface of the insulating layer, and a semiconductor chip mounted on a insulating layer side of the lead, and a heat sink formed on the backside of the insulating layer. The semiconductor chip is mounted on the lead by flip-chip bonding and sealed in the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.