Anisotropic conductive film bonding pad
US7038327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Feb 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.