Sealing lighting device component assembly with solder glass preform by using infrared radiation
US7040121B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Dec 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/32
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for sealing and affixing a component assembly for an electrical lighting device to a glass lamp envelope. The assembly used in the process comprises the component, such as an electrode lead wire and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30–45×10−7° C.−1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.