Micromechanical high-pressure sensor

US7040172B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Thomas Moelkner · Stuttgart, DE
• Ralf Henn · Singapore, SG
• Werner Steiner · Schrobenhausen, DE
• Hans-Peter Didra · Tübingen, DE
• Philip Cutuli · Reutlingen, DE
• Frank Klopf · Munich, DE

Key dates

• Filing date: Feb 16, 2005
• Grant date: May 9, 2006
• Expiry date: Feb 16, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L9/08
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical pressure sensor and a method for producing a micromechanical pressure sensor. This pressure sensor has at least one membrane and a measuring element situated on the membrane. A pressure applied at the membrane or a pressure differential applied at the different sides of the membrane results in deformation of the membrane. Simultaneous with the deformation of the membrane, the measuring element is subjected to elastic elongation and/or compression. In a piezo-sensitive component, such elastic elongation and/or compression generates a measured variable in the measuring element, which represents the applied pressure or the applied pressure differential at the membrane. It is provided in this context that the measuring element have at least partially a NiCr(Si) layer. Due to an at least partial crystallization in the production of the micromechanical pressure sensor, this NiCr(Si) layer has more advantageous piezoelectrical characteristics than an amorphous NiCr(Si) layer.