Die cleaning method
US7040327B2 · kind B2 · utility
2Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2003 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jan 31, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/60
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.