Manifold with film heater
US7040378B2 · kind B2 · utility
7Cited by
39References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2003 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Dec 8, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides improved heated manifolds, heaters and nozzles for injection molding, having a high strength metal skeleton infiltrated with a second phase metal having higher thermal conductivity. Also disclosed is method of forming a manifold, heater or nozzle preform and infiltrating the preform with a highly thermally conductive material. The invention also provides a method of simultaneously infiltrating and brazing injection molding components of similar or dissimilar materials together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.