Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
US7041536B2 · kind B2 · utility
0Cited by
14References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2004 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Feb 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor circuit chip bonded onto the substrate and having an electrode connected to the circuit pattern, a reinforcement metal plate, and a seal resin portion for covering a peripheral face of the semiconductor integrated circuit chip and sticking the reinforcement metal plate onto the semiconductor integrated circuit chip is mounted within a card substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.