Method and apparatus for a backsided and recessed optical package connection
US7042082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2005 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jan 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02345
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.