In situ molded thermal barriers
US7043880B2 · kind B2 · utility
114Cited by
63References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Apr 15, 2023 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04B1/94
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The invention provides methods, systems, and devices for installing thermal barriers in openings or gaps in or between structures such as walls, ceilings, and floors. At least one thermal barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to mold a barrier in the hole or gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.