Bonding apparatus with position deviation correction
US7044182B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Jun 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus that makes correction ΔX=(Xn−Xc) in positioning of bonding tool and substrate where the imaging center of first camera shows deviation +Xc with respect to the imaging center of second camera, and deviation +Xn occurs when bonding tool moves from height Z1 to height Z2. A target is disposed at height Z1 in a correcting position, and a correction camera is disposed beneath the target. The correction amount ΔX=(Xn−Xc)=X3−(X2+X1) is determined based upon first positional deviation X1 which is the position of a chip 10d at height Z1 seen from the target, second positional deviation X2 which is the position of the target seen from the imaging center of the second camera, and third positional deviation X3 which is the position of the chip 10u at height Z2 seen from the imaging center of the first camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.