Bonding apparatus and bonding external appearance inspection device
US7044355B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 18, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Oct 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01084
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire bonder 50 in which light rays 66 that leave an object on a carrying stand 60 pass through a light path 80 that passes through a parallel flat plate and reach an imaging camera 70 as light rays 68. The light path 80 that passes through a parallel flat plate includes a half-mirror 82 disposed in the light path, a parallel flat plate 86, and a reflective mirror 88 which is disposed perpendicular to the optical axis of the light rays 96 that have passed through the parallel flat plate 86 and which performs a mirror reflection operation, in a plane perpendicular to the optical axis, on the light rays 96, so that the light rays again return to the parallel flat plate 86 as reflected light 98.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.