Liquid thermal management socket system
US7044768B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Oct 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A liquid thermal management socket system for thermally managing an electronic device in a socket. The liquid thermal management socket system includes a thermal management unit having a chamber for receiving one or more electronic devices, a plurality of first connectors within the thermal management unit for electrically coupling with the electronic device, and a plurality of second connectors electrically coupled to the first connectors, wherein the second connectors extend from the thermal management unit for electrically coupling within a socket unit on a board. The thermal management unit may have a cap member attachable to a base portion in a sealed manner. The chamber within the thermal management unit may thermally manage an electronic device within via spray cooling, liquid immersion or other liquid cooling method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.