Surface mount header assembly having a planar alignment surface
US7044812B2 · kind B2 · utility
3Cited by
14References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Nov 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/0263
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A header assembly includes an insulative housing comprising a plurality of walls defining an interior cavity, and a plurality of contacts within said cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulating housing comprises at least one alignment rib extending on an exterior surface thereof. The contacts are formed to abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.