Apparatus for transporting and polishing wafers
US7044833B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Dec 2, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.