Dicing and testing optical devices, including thin film filters
US7045370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2002 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Nov 17, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.