Semiconductor device fabrication method
US7045446B2 · kind B2 · utility
37Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Dec 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device fabrication method using a fluidic self-assembly technique in which in a liquid, a plurality of semiconductor elements are mounted in a self-aligned manner on a substrate with a plurality of recessed portions formed therein, protruding potions that are inserted in the respective recessed portions of the substrate are formed in the lower portions of the respective semiconductor elements, the liquid in which the semiconductor elements have been spread is poured over the substrate intermittently, and the substrate is rotated in a period of time in which the liquid is not poured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.