Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
US7045586B2 · kind B2 · utility
4Cited by
62References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Feb 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.