Method of producing an electronic device and electronic device
US7045712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Aug 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing an electronic device, with a stamped sheet-metal part loaded with electronic components being encapsulated in a thermoplastic, insulating material to provide protection against environmental influences, and also an electronic device comprising electronic components arranged on a stamped sheet-metal part and electrically connected to one another by the part, the stamped sheet-metal part and the electronic components being encapsulated in the thermoplastic, insulating material by the injection-molding process. Providing a device with which protection of the electronic components during encapsulation is ensured, the stamped sheet-metal part (2) has at least one region (3) similar to a protective shield, under which the electronic components are arranged, and the electronic components (4) are arranged downstream of the stamped sheet-metal part (2) in the direction of injection pressure (9) of the heated, thermoplastic, insulating material (5)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.