Architecture for power modules such as power inverters
US7046535B2 · kind B2 · utility
29Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Dec 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/14329
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.