Digital clay apparatus and method
US7047143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method for controlling the surface and/or volume of a digital clay device is provided. One embodiment, among others, is a method comprising the following steps: determining a desired position of a skeleton structure portion residing in the digital clay device, determining a volumetric change of fluid residing in a fluid cell, the determined volumetric change corresponding to the determined desired position of the skeleton structure portion, opening a valve so that the fluid flows through the valve thereby causing the determined volumetric change of the fluid, and adjusting a position of the skeleton structure portion corresponding to the desired position of the skeleton structure portion, the position adjustment caused by a force generated by the fluid cell on the skeleton structure portion when the volume of the fluid cell changes in response to the determined volumetric change of the fluid residing in the fluid cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.