Apparatus for mounting electronic module assembly in sensor
US7047823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2004 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Jun 23, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60R21/01516
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An occupant weight sensor (1) for placement between a frame (7) fixed to the chassis of a vehicle and a second frame (8) supporting a vehicle seat has a sense element having a first body (12, 22, 28, 34, 50, 62, 64, 68, 84) formed with a planar sense surface on which are mounted piezoresistors electrically connected in a Wheatstone bridge configuration. A post (12a, 22c, 28c, 34e, 50b, 62a, 64a, 68b, 84g) extends outwardly from the first body for attachment to the first frame. A second body is formed with a force transfer portion (14a, 24g, 30d, 36b, 52a, 70a, 94a) permanently attached to the first body along an outer periphery circumscribing the sense surface. The piezoresistors are electrically connected to conditioning electronics received in a chamber formed between the two bodies. The effects of parasitic loads on the sense element are minimized by selected placement of the piezoresistors on the sense surface. In one embodiment, attachment stresses of an electronic module assembly (88) are isolated from the sense surface by attaching the assembly to a support ring end wall (86a) welded to a portion of the first body removed from the sense surface and providing a control gap be…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.