Foil-form soldering metal and method for processing the same
US7048813B2 · kind B2 · utility
4Cited by
2References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Dec 14, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/14
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subjected to heat treatment for five minutes to ten hours at 200° C. to 270° C., and subsequently the foil-form soldering metal is slit. Thus, the heat treatment of the Au—Sn soldering metal before slitting enables continuous slitting of the Au—Sn foil-form soldering metal in room temperature and facilitates the production of a ribbon-form soldering metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.