Organic compositions
US7049005B2 · kind B2 · utility
3Cited by
2References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2002 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Oct 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a composition comprising: The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.