Multilayer structure based on polyamides and on a tie layer made of a copolyamide blend
US7049006B2 · kind B2 · utility
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2References
20Claims
0Family size
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Key dates
| Filing date | Nov 2, 2004 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Nov 2, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31743
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multilayer structure based on polyamides, comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.