Electrical package employing segmented connector and solder joint
US7049171B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2004 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Jul 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided having a connector and a solder joint that is less susceptible to thermal fatigue. The package includes a die including a first electrically conductive connecting surface having a first coefficient of thermal expansion and a substrate including electrical circuitry and a second electrically conductive connecting surface having a second coefficient of thermal expansion. The package further includes a solder joint connecting the first connecting surface to the second connecting surface. One of the first and second connecting surfaces includes a plurality of pads spaced from each other. By employing an electrical connection having a plurality of pads spaced from each other, the solder joint is relieved to reduce fatigue caused by thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.