Packaging structure and process of electronic card
US7049172B2 · kind B2 · utility
2Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2004 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Sep 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0269
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.