Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
US7049371B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.