Method of defining features on materials with a femtosecond laser
US7049543B2 · kind B2 · utility
15Cited by
12References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2003 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Nov 7, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.