Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
US7049704B2 · kind B2 · utility
33Cited by
13References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2004 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Aug 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.