Sensor assembly
US7050176B1 · kind B1 · utility
5Cited by
3References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Dec 2, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/7779
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a sensor assembly and method for measuring changes in dimension and/or composition of a sensor component (and associated factors) caused by the introduction of or changes in a chemical, physical or biological stimulus in a localized environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.