Method of manufacturing a printed board assembly
US7051430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | May 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.