Component mounting control method
US7051431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2003 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Jul 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.