Heat dissipation device
US7051792B2 · kind B2 · utility
4Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2004 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Aug 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device includes a base (10) having a heat dissipating surface, a plurality of fins (20) and a pair of heat pipes (30). The fins cooperatively define a concave tunnel in a side thereof. The heat dissipating surface of the base is embedded in the tunnel of the fins. Each heat pipe has a vaporizing portion (32) engaged with the base and a condensing portion (31) engaged in the fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.